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Semi Processing Platform Wet Station
- New
| Process | CLEAN |
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| Manufacturer | RENA |
Fast and precise semiconductor processing
High flexibility and precise process control
The automatic wet processing systems for 200 mm and 300 mm wafers support processing with and without carriers. They are engineered for precise process monitoring, high productivity and flexibility during production. The RENA Semi Processing Platform offers maximum production quality and throughput with the flexibility to be adjusted to customer requirements. The platform highlight is a flexible carrierless handling system, which allows parallel processing of different wafer thicknesses.
Technical Data SEMI Processing Platform
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Process Application |
Etching (Si-Etch, Metal Etch, Oxide Etch, Nitrid Etch etc.) Solvent (Metal Lift-off, Resist Strip, BEOL clean etc.) Cleaning (SPM, SC1, SC2, DHF/O3 etc.) Drying (IPA Marangoni Dry, IPA Vapor Dry, Hot Water Dry) |
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Advanced process control |
Chemical/Ozone concentration monitoring and regulation, DIW-resistivity, precision chemical mixing and spiking, feed & bleed |
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Substrates |
Si, SiC, GaAs, GaN, InP, Glas, Sapphire |
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Thickness Range |
500～2000 μm | ||
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Housing Material |
PP, FM4910-compliant material, Stainless Steel |
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Dimensions |
Width* 2200 mm Height 3600 mm (including flow box) Total length according to process specification * for special applications width can be adapted |
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Module Dimensions |
Wafersize 200 mm / 8” 300 mm / 12” 2 bath module 1400 mm 1600 mm 3 bath module 2100 mm 2400 mm |
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Options |
Fully automatic loading/unloading buffer station Customized process carriers Bulk chemical supply systems |
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CONTACT US
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Office phone number
03-6423-0130【Operating hours】 9:00～17:30
*Excluding Saturdays, Sundays, holidays, year-end and New Year holidays, and company holidays. -
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