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•　Provides process consistency to develop your POR

•　Highly flexible software enables rapid process development

•　Standard dual tank design provides multi-step processing

•　Excellent etch uniformity even with etch rates > 100 A/sec

•　Manual or automated wafer handling

•　Rapid quenching etch with spin dry providing excellentparticle performance

•　Low cost of ownership

•　Small Footprint

•　For low throughput applications

•　Acid and Solvent Processes

•　Integrated wafer handling capabilities that table top spinnersdo not offer

•　Process performance exceeds batch systems where etchuniformity is critical in low volume applications

•　2 to 4 Chemical process tanks

•　Wafers up to 200mm and masks up to 7 x 7

•　A single or dual moving spray arms with separate chem lines

•　Stationary bottom spray nozzles for DI and N2

•　Multiple chem feeds to the back of the unit from external sources

•　Dedicated drains with software controlled diverter valve

•　FEoL & BEoL processing applications